Wafer TTV, Bow, saw marks inspection system:
The ATM TTV, bow and saw mark inspection system is a fast, non-contact technology and very small and easy to use system to detect defects in wafers for solar production application.
Types of defects:
- TTV
- Saw mark
- Bow
- Flatness
- Thickness
Features:
TTV, Thickness, Saw mark
TTV, MTV, LTV, saw mark, thickness, bending measurement over the surface
For 1 trace both side
Option:
TTV for 2 traces
Article number: 02-0000-09-01
Option:
TTV for 3 traces
Article number: 02-0000-09-02
Option:
TTV for 5 traces
Article number: 02-0000-09-03