Wafer TTV, Bow, saw marks inspection system:

The ATM TTV, bow and saw mark inspection system is a fast, non-contact technology and very small and easy to use system to detect defects in wafers for solar production application.

Types of defects:

- TTV
- Saw mark
- Bow
- Flatness
- Thickness

Features:

• 3600 wafers/h
• Non contact
• Very small and easy to use
• Ethernet tools
• Remote control
• Intelligent software
• Connection to the master PC
• And more

TTV, Thickness, Saw mark
TTV, MTV, LTV, saw mark, thickness, bending measurement over the surface 
For 1 trace both side

Option:
TTV for 2 traces
Article number: 02-0000-09-01

Option:
TTV for 3 traces
Article number: 02-0000-09-02

Option:
TTV for 5 traces
Article number: 02-0000-09-03