The future technology in the semiconductor industry and production-
Stand-Alone Spin Coating System "Covered Chuck" and Hotplate within process:

OPTIcoat ST 32+

• Stand - Alone Spin Coating System with "Covered Chuck"
  technology with Hotplate for wafers up to Ø 12" (Ø 300 mm)
  and substrates up to 9" x 9" (225 mm x 225 mm), for traditional
  open bowl or covered chuck spinning

System consists of:

• Stand - Alone cabinet with all process modules integrated
• Spinner system with "Covered Chuck" technology and automatic substrate pin lift
• Multi piece process bowl (easily dismountable for cleaning purposes) with splash ring
• Hotplate OPTIhot HB 30 with programmable lifting pins (proximity) for 4" - 12" Wafer
• Programmable Nitrogen (N2) blow
• Input display unit with touch for each system
• Including software for PC / Notebook - For more comfortable
  recipe writing and storage
• Including an ENGLISH manual on standard paper and a CD-ROM
• Price without installation and training
• Requires at least one chuck (Not included !)

Technical Data:

• Voltage: UAC= 3 x 400 V / N/PE/50 Hz (60Hz)/16
• Motor-Speed: 1 up to 6,000rpm in 1rpm steps
• Motor-Acceleration ramp: 1 up to 3,000 rpm/sec in steps 1rpm/sec
• Substrate size: Up to Ø 12" (Ø 300 mm) or 9" x 9" (225 mm x 225 mm)
• Process bowl: Standard made of Polypropylene (PP)
• Process exhaust: With outer diameter Ø 110 mm, 650m3/h
• Cabinet exhaust #1: Outer diameter Ø 110 mm, 40m3/h
• Cabinet / HP exhaust #2: Outer diameter Ø 110 mm, 40m3/h
• Drain: Standard 5 liter PEHD waste tank with high-level sensor
• Compressed air: Clean Dry Air (CDA) 8 ± 2 bar
• Vacuum: -0.8 ± 0.2 bar
• Nitrogen (N2): 4.0 ± 0.5 bar
• CE marked system

Hotplate:

• Temperature range: Up to 300°C - Adjustable in 0.1°C steps
• Hotplate time: 1 up to 999 s - Adjustable in 0.1 s steps
• Proximity: Programmable in 0.1 mm steps
• For Wafer: Up to Ø 12" (Ø 300 mm)
• For Substrate: Up to 9" x 9" (225 mm x 225 mm)
• Lifting pins: For Ø 4" up to Ø 12"