The future technology in the semiconductor industry and production-
Spin Coating Module "Covered Chuck"within process:

OPTIcoat SB 30

• Bench Mounted Spin Coating System with "Covered Chuck" technology for Wafers up to Ø 12" (Ø 300 mm) and substrates up to 9" x 9" (225 mm x 225 mm), for traditional open bowl or covered chuck spinning

System consists of:

• Spinner system with "Covered Chuck" technology and automatic substrate pin lift
• Multi piece process bowl (easily dismountable for cleaning purposes) with splash ring
• Controller unit
• Input display unit with touch
• Including software for PC / Notebook - For more comfortable recipe writing and storage
• Including an ENGLISH manual on standard paper and a CD-ROM
• Price without installation and training
• Requires at least one chuck (Not included !)

Technical data:

• Voltage: UAC= 3 x 400 V / N/PE/50 Hz (60Hz)/16A
• Motor-Speed: 1 up to 6,000rpm in 1rpm steps
• Motor-Acceleration ramp: 1 up to 3,000 rpm/sec in steps 1rpm/sec
• Spinning time: 1 up to 999 s - Adjustable in 0.1 s steps
• Substrate size: Up to Ø 12" (Ø 300 mm) or 9" x 9" (225 mm x 225 mm)
• Process bowl: Standard made of Polypropylene (PP)
• Process exhaust: Outer diameter Ø 110 mm, 200 m3/h
• Drain: Standard 5 liter PEHD waste tank with high-level sensor
• Compressed air: Clean Dry Air (CDA) 8 ± 2 bar
• Vacuum: -0.8 ± 0.2 bar
• Nitrogen (N2), optional: 4.0 ± 0.5 bar
• CE marked system

Chuck: Option