The future technology in the semi conductor industry and production-
bench mounted Hotplate System for typical lithography baking applications:

OPTIhot HB 20

• Bench Mounted Hotplate System for wafers up to Ø 8" (Ø 200 mm)and substrates up to 6" x 6" (150 mm x 150 mm)

System consists of:

• Hotplate System with cover
• Lifting pins after process for 2" - 8" wafer
• Input controller
• Preset and calibrated temperature controller
• Including an ENGLISH manual on standard paper and a CD-ROM
• Hotplate System with cover and controller
• Price without installation and training

Technical data:

• Voltage: UAC= 110 V / N / PE / 60 Hz / 16A or UAC= 230 V / N / PE / 50 Hz / 16A
• Temperature range: Up to 300°C - Adjustable in 1°C steps
• Hotplate time: 1 up to 999 s - Adjustable in 0.1 s steps
• Substrate size: Up to Ø 8" (Ø 200 mm) or 6" x 6" (150 mm x 150 mm)
• Process exhaust: Outer diameter OD 38 mm, 30m3/h
• Compressed air: Clean Dry Air (CDA) 8 ± 2 bar
• Vacuum: -0.8 ± 0.2 bar
• Nitrogen (N2): 4.0 ± 0.5 bar
• CE marked system

Hotplate: Option