Product data sheet

TTV, Bow & Saw mark

Article number: 02-0000-09-00

Wafer TTV, Bow, saw marks inspection system:

The ATM TTV, bow and saw mark inspection system is a fast, non-contact technology and very small and easy to use system to detect defects in wafers for solar production application.

Types of defects:

- Saw mark
- Bow
- Flatness
- Thickness


  • 3600 wafers/h
  • Non contact
  • Very small and easy to use
  • Ethernet tools
  • Remote control
  • Intelligent software
  • Connection to the master PC
  • And more

TTV, Thickness, Saw mark
TTV, MTV, LTV, saw mark, thickness, bending measurement over the surface 
For 1 trace both side

TTV for 2 traces
Article number: 02-0000-09-01

TTV for 3 traces
Article number: 02-0000-09-02

TTV for 5 traces
Article number: 02-0000-09-03

Product images