ATMgroup

产品规格

Spin Coating- OPTIspin ST32

产品编号: 51-0002-10-00

The future technology in the semiconductor industry and production-
Stand Alone Spinner system for coating, cleaning and developing within process:

OPTIspin ST 32

  • Stand - Alone Spin Coating System for wafers up to Ø 12" (Ø 300 mm) and substrates up to 9" x 9" (225 mm x 225 mm), for traditional open bowl spinning

System consists of:

  • Stand Alone cabinet with all process modules integrated
  • Spinner system with process bowl cover (hardware interlock secured)
  • Multi piece process bowl (easily dismountable for cleaning purposes) with splash ring
  • Input display unit with touch for spin coater
  • Temperature controller and timer for hotplate
  • USB 2.0 port for data exchange
  • Hotplate OPTIhot HB 30 with lifting pins for 4" up to 12"
  • Including software for PC / Notebook - For more comfortable recipe writing and storage
  • Including an ENGLISH manual on standard paper and a CD-ROM
  • Price without installation and training
  • Requires at least one chuck (Not included !)

Technical Data:

  • Voltage: UAC= 230 V / N / PE / 50 Hz (60 Hz) / 16A
  • Motor speed: 1 - 6,000 rpm - Adjustable in 1 rpm steps (depending on substrate size and load)
  • Motor acceleration ramp: 1 up to 2,500 rpm/s - Adjustable in 1 rpm/s steps (depending on substrate size and load)
  • Spinning time: 1 up to 999 s - Adjustable in 0.1 s steps
  • Substrate size: Up to Ø 12" (Ø 300 mm) or 9" x 9" (225 mm x 225 mm)
  • Process bowl: Standard made of Polypropylene (PP)
  • Process exhaust: Outer diameter OD 110 mm, 200m3/h
  • Cabinet exhaust #1: Outer diameter OD 110 mm, 200m3/h
  • Cabinet / HP exhaust #2: Outer diameter OD 110 mm, 200m3/h
  • Drain: 5 liter waste tank and high-level sensor, inside the cabinet
  • Compressed air: Clean Dry Air (CDA) 8 ± 2 bar
  • Vacuum: -0.8 ± 0.2 bar
  • Nitrogen (N2): 4.0 ± 0.5 bar
  • CE marked system

Hotplate:

  • Temperature range: Up to 300°C - Adjustable in 1°C steps
  • Hotplate time: 1 up to 999 s - Adjustable in 0.1 s steps
  • For wafer: Up to Ø 12" (Ø 300 mm)
  • For substrate: Up to 9" x 9" (225 mm x 225 mm)
  • Lifting pins: From Ø 4" up to Ø 12"


Chuck: Option

Dispense: Option

Nozzle: Option

Hotplate: Option