ATMgroup

Product data sheet

Spin Coating- OPTIcoat ST23+

Article number: 51-0003-01-06

The future technology in the semiconductor industry and production-
Stand-Alone Spin Coating System with "Covered Chuck", Hotplate and HMDS within process:

OPTIcoat ST 23+

  • Stand - Alone Spin Coating System with "Covered Chuck"
    technology with Hotplate and HMDS Hotplate for Wafers up to Ø 8" (Ø 200 mm) and substrates up to 6" x 6" (150 mm x 150 mm), for traditional open bowl or covered chuck spinning



System consists of:

  • Stand - Alone cabinet with all process modules integrated
  • Spinner system with "Covered Chuck" technology and automatic substrate pin lift
  • Multi piece process bowl (easily dismountable for cleaning purposes) with splash ring
  • Hotplate OPTIhot HB 20+ with programmable lifting pins (proximity) or 2" - 8" wafer
  • Programmable Nitrogen (N2) blow
  • Vapor prime HMDS (HexaMethylDiSilazan) Hotplate OPTIhot VB 20
  • Input display unit with touch for each system
  • USB 2.0 port for data exchange
  • Including software for PC / Notebook - For more comfortable recipe writing and storage
  • Including an ENGLISH manual on standard paper and a CD-ROM
  • Price without installation and training
  • Requires at least one chuck (Not included !)



Technical Data:

  • Voltage: UAC= 3 x 400 V / N / PE / 50 Hz (60 Hz) / 16A
  • Motor-Speed: 1 up to 10,000rpm in 1rpm steps
  • Motor-Acceleration ramp: 1 up to 50,000 rpm/sec in steps 1rpm/sec
  • Spinning time: 1 up to 999 s - Adjustable in 0.1 s steps
  • Substrate size: Up to Ø 8" (Ø 200 mm) or 6" x 6" (150 mm x 150 mm)
  • Process bowl: Standard made of Polypropylene (PP)
  • Process exhaust: Outer diameter OD 110 mm, 200m3/h
  • Cabinet exhaust #1: Outer diameter OD 110 mm, 200m3/h
  • Cabinet / HP exhaust #2: Outer diameter OD 110 mm, 200m3/h
  • Process exhaust HMDS: Outer diameter OD 110 mm, 200m3/h
  • Cabinet exhaust HMDS: Outer diameter OD 110 mm, 200m3/h
  • Drain: 5 liter waste tank and high-level sensor, inside the cabinet
  • Compressed air: Clean Dry Air (CDA) 8 ± 2 bar
  • Vacuum: -0.8 ± 0.2 bar
  • Nitrogen (N2): 4.0 ± 0.5 bar
  • CE marked system



Hotplate:

  • Temperature range: Up to 300°C - Adjustable in 0.1°C steps
  • Hotplate time: 1 up to 999 s - Adjustable in 0.1 s steps
  • Proximity: Programmable in 0.1 mm steps
  • For Wafer: Up to Ø 8" (Ø 200 mm)
  • For Substrate: Up to 6" x 6" (150 mm x 150 mm)
  • Lifting pins: For Ø 2" up to Ø 8"



HMDS (HexaMethylDiSilazan) Vapor Prime Hotplate:

  • Temperature range: Up to 200°C - Adjustable in 0.1°C steps
  • For wafer: Up to Ø 8" (Ø 200 mm)
  • For substrate: Up to 6" x 6" (150mm x 150mm)
  • Lifting pins: For Ø 2" up to Ø 8"